ROBOTIC ADDITIVE @ MECSPE 2023!

This year, the additive manufacturing industry is set to witness significant advancements with the introduction of the Robotic Additive Molding (RAM) technology. This method will be incorporating a variable layer height technique, which will allow for conformal printing on molds and non-planar printing via robotic arms.

RAM technology offers unparalleled precision and flexibility in the manufacturing of complex, three-dimensional objects. With the addition of the variable layer height technique, RAM technology can now achieve even greater levels of accuracy and intricacy.

This groundbreaking technology will be presented for the first time at the Mecspe fair by GIMAC and INDEXLAB in a joint research presentation.

Attendees at the Mecspe fair in Bologna will have the opportunity to see firsthand how the RAM technology works and learn more about its potential applications in a variety of industries.

Experts from GIMAC and INDEXLAB will also be on hand to provide additional information and answer any questions about the technology.

With GIMAC and INDEXLAB's joint research on the forefront of additive manufacturing, the MECSPE fair promises to be a must-attend event for anyone looking to stay ahead of the curve in the manufacturing industry.

Be sure to mark your calendars for March 29th to 31st, 2023, and register online today!